封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Mode:Enhancement
VGS(th) min max:2.0V 3.5V
VDS:100 V
RDS (on):1.9m?
Die Size (Y):6 mm
Die Size (X):5.2 mm
Thickness:220
Die Size (Area):31.2 mm2
EAS/Avalanche Energy:45.0mJ
無(wú)鉛情況/RoHs:無(wú)鉛/符合RoHs