封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Budgetary Price ?€/1k:1.87
Mode:Enhancement
VGS(th) min max:2.0V 4.0V
VDS:120 V
RDS (on):3.0m?
Die Size (Y):6.6 mm
Die Size (X):3.96 mm
Thickness:250
Die Size (Area):26.13 mm2
無鉛情況/RoHs:無鉛/符合RoHs