封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Budgetary Price ?€/1k:2.49
Mode:Enhancement
VGS(th) min max:2.0V 4.0V
VDS:200 V
RDS (on):9.4m?
Die Size (Y):6.7 mm
Die Size (X):4.5 mm
Thickness:250
Die Size (Area):30.15 mm2
EAS/Avalanche Energy:45.0mJ
無鉛情況/RoHs:無鉛/符合RoHs