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Packing Type��WAFER SAWN
Technology��OptiMOS? 3
Budgetary Price ?�/1k��2.45
Mode��Enhancement
VGS(th) min max��2.0V 4.0V
VDS��250 V
RDS (on)��16.0m?
Die Size (Y)��6.7 mm
Die Size (X)��4.5 mm
Thickness��250
Die Size (Area)��30.15 mm2
EAS/Avalanche Energy��40.0mJ
�o�U��r/RoHs���o�U/����RoHs