封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Budgetary Price ?€/1k:0.21
Mode:Enhancement
VGS(th) min max:1.0V 2.2V
VDS:30 V
RDS (on):5.0m?
Die Size (-) min max:1.24mm2 2.26mm2
Die Size (Y):2.26 mm
Die Size (X):1.24 mm
Thickness:175
Die Size (Area):2.80 mm2
無鉛情況/RoHs:無鉛/符合RoHs