封裝/外殼:--
Packing Type:WAFER SAWN
Technology:OptiMOS? 3
Budgetary Price ?€/1k:0.18
VGS(th) min max:1.0 V 2.2 V
Mode:Enhancement
VDS:30 V
RDS (on):5.3 m?
Die Size (-) min max:1.05 mm2 2.1 mm2
Die Size (Y):2.1 mm
Die Size (X):1.05 mm
Thickness:175
Die Size (Area):2.2 mm2
EAS/Avalanche Energy:50.0mJ
無(wú)鉛情況/RoHs:無(wú)鉛/符合RoHs